| Layer | 1-60 Layers (2026: up to 80 Layers for HPC) | Layer is the number of layers of the design file, and to the final announcement of the site prevail. 2026 upgrade: Support 80-layer high-performance computing (HPC) PCB with HDI sequential lamination. |
| Materials Type | FR-4，Taconic,Isola，Rogers (2026: Added Megtron 8, Nelco 4000-13) | Materials Type: Supply FR4, Aluminum ,Rogers,Taconic,ect. 2026 upgrade: Introduce low-loss high-frequency materials (Megtron 8/Nelco 4000-13) for 5G/6G and automotive radar applications. |
| Max size | 500x1500mm (2026: 600x1800mm for large-panel manufacturing) | Only allowed to receive 550x400mm, and the other can be connected to the long board 1500mm currently. 2026 upgrade: Support 600x1800mm large-panel manufacturing to reduce production cost for automotive PCBA. |
| Dimension Precision | ±0.1mm (2026: ±0.05mm for high-precision automotive/medical) | Outline tolerance. 2026 upgrade: Achieve ±0.05mm dimensional precision for automotive ADAS and medical device PCB via AI-driven CNC machining. |
| Board Thickness Range | 0.15–6.0mm (2026: 0.1mm ultra-thin flexible-rigid PCB) | Produce: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0/4.0mm. 2026 upgrade: Add 0.1mm ultra-thin flexible-rigid PCB for wearable devices and foldable electronics. |
| Board Thickness Tolerance (t≥1.0mm) | ±10% (2026: ±5% for high-reliability applications) | Notes: Due to the production process causes (like Plating copper, sold mask, Solder coating will increase the thickness of the Board) generally take a positive tolerance. 2026 upgrade: Reduce tolerance to ±5% for aerospace/defense high-reliability PCB via automated thickness inspection. |
| Min Line Width | 2mil（0.05mm）(2026: 1mil (0.025mm) for HDI 4th gen) | Line width be possible greater than 2mil, and the minimum is not less than 2mil; for multiple layer board: both the inner and outer layer can not be less than 0.05mm. 2026 upgrade: Support 1mil (0.025mm) min line width for 4th-gen HDI PCB (used in flagship smartphones/AI modules). |
| Min Line Space | 2mil（0.05mm）(2026: 1mil (0.025mm) for HDI 4th gen) | The gap is possible to greater than 2mil,and the minimum is not less than 2mil. 2026 upgrade: Achieve 1mil (0.025mm) min line space with laser direct imaging (LDI) and advanced photoresist technology. |
| Outer Layer Finished Copper Thickness | 35um/280um（1OZ/8OZ）(2026: Up to 350um (10OZ) for power PCB) | Refers to the thickness of the copper foil in the outer finished circuit board ,1 OZ＝35um 3 OZ=105um. 2026 upgrade: Support 350um (10OZ) thick copper for high-power industrial/automotive power PCB with improved thermal management. |
| Inner Layer Finished Copper Thickness | 17um-240um (2026: 12um ultra-thin for high-density inner layer) | Refer to the Finished Thickness of Multi Inner Layer Copper . 2026 upgrade: Add 12um ultra-thin inner layer copper for high-density server PCB to reduce signal interference. |
| Drilling hole(machine drill) | 0.1–6.5mm (2026: Laser drill 0.05mm micro-via for HDI) | 0.3mm is the min hole and 6.3mm is the max hole, if bigger than 6.3mm the factory need process it separately. 2026 upgrade: Laser drilling for 0.05mm micro-via (blind/buried via) in HDI PCB, machine drill max 8.0mm for industrial connectors. |
| Single Side Welding Ring | ≥0.1mm（4mil）(2026: ≥0.08mm (3mil) for ultra-miniature BGA) | There has no single side limit If the conductive hole or plug hole is too small, but had enough space; If there is not enough space, the Min single side welding ring should not less than 0.153mm. 2026 upgrade: Support 0.08mm (3mil) welding ring for ultra-miniature BGA (0.2mm pitch) via advanced solder mask alignment. |
| Finished Hole Diameter(machine drill) | 0.1–6.5mm (2026: Laser drill 0.05mm for micro-via) | Due to there has metal copper stick in the inner hole, the hole diameter of the hole is generally smaller than the hole in Original file. 2026 upgrade: Laser-drilled micro-via with 0.05mm finished diameter for 5G RF modules. |
| Hole Tolerance(machine drill) | ±0.05mm (2026: ±0.02mm for laser-drilled holes) | The tolerance of drilling hole is 0.05mm, for example, the hole is designed to be 0.6mm, and the finished hole of the real board is qualified in the 0.55–0.65mm. 2026 upgrade: Laser-drilled holes achieve ±0.02mm tolerance for aerospace PCB applications. |
| Solder Type | Photosensitive ink (2026: UV-curable low-outgassing ink) | Photosensitive ink is the most common type now. thermosetting ink is used in low-grade single-sided cardboard generally. 2026 upgrade: Adopt UV-curable low-outgassing solder mask ink for space/aerospace PCB (meets NASA outgassing standards). |
| Min Legend Width | ≥0.15mm (2026: ≥0.1mm with laser marking) | If the minimum width of the Legend is less than 0.15mm, the actual board may not clear which caused by the design reasons. 2026 upgrade: Laser marking achieves 0.1mm min legend width with high contrast for medical/automotive traceability. |
| Min Legend Height | ≥0.8mm (2026: ≥0.5mm with laser marking) | If the minimum height of the Legend is less than 0.8mm, the actual board may not clear which caused by the design reasons. 2026 upgrade: Laser marking supports 0.5mm min legend height without resolution loss. |
| Legend Aspect Ratio | 1:5 (2026: 1:8 for ultra-fine laser marking) | The most appropriate aspect ratio, more facilitate to production. 2026 upgrade: Support 1:8 aspect ratio for ultra-fine legend text via AI-optimized laser marking parameters. |
| Space between Line and Outline | ≥0.3mm（12mil）(2026: ≥0.2mm (8mil) for high-density design) | If come out by Routing, the distance between the line and the line layer is not less than 0.3mm; if come out by the V cut ,the distance from the center line to the V cutting line can not be less than 0.4mm. 2026 upgrade: Reduce to 0.2mm (8mil) for high-density automotive PCB via precision routing with real-time vision alignment. |
| Make-up: Gapless imposition clearance | “0”gap (2026: AI-optimized panelization for 0-gap) | Clearance of the intermediate plate and the plate is 0 (a detailed document). 2026 upgrade: AI-driven panelization software optimizes 0-gap imposition to maximize panel utilization (up to 95% material usage). |
| Panelization: Gap Requires | 1.6mm (2026: 1.2mm for micro-routing) | For the clearance gap is no less than 1.6mm, otherwise routing is very hard. 2026 upgrade: Micro-routing technology supports 1.2mm panel gap to increase panel density. |
| Pads(Manufacturer pave copper) | Hatch pave copper (2026: AI-optimized copper paving) | Manufacturer are using the reduction method, Pay attention to it for use Pads design customers. 2026 upgrade: AI-optimized copper paving reduces thermal stress and improves solder joint reliability for high-power PCB. |
| Pads Software to Draw the Slot | With drill Drawing layer (2026: Support ODB++ v8 for smart factory) | If there has many Non-PHT Slot , please draw in the Drill Drawing layer. 2026 upgrade: Full support for ODB++ v8 format for seamless integration with smart factory MES systems. |
| Draw Windowing Layer In Protel/Dxp | Solder layer (2026: Support Altium 24+ smart windowing) | A few engineers put to the paste layer, we will not process paste layer.Attention. 2026 upgrade: Compatibility with Altium 24+ smart windowing feature for automated solder mask opening optimization. |
| Outline Layer In Protel/Dxp | Use Keep out layer or Mechanical layer (2026: AI outline verification) | Notes: One file only allows one Outline layer exist , and never allow two Outline layer one time. please remove the useless outline layer, that is, Keep out layer and mechanical layer can only choose one. 2026 upgrade: AI-powered outline verification automatically detects and cleans up duplicate outline layers to reduce production errors. |
| Half Hole :Min Half Hole Diameter/Dxp | 0.4mm (2026: 0.3mm for ultra-small half-hole) | Half hole process is a special process, and the min hole dia should be bigger than 0.6mm. 2026 upgrade: Achieve 0.3mm min half-hole diameter via precision laser cutting for wearable device connectors. |
| Soldermask Opening | 0.1mm (2026: 0.08mm for ultra-fine pitch components) | Solder mask is often said green color, it can be done in the process of soldmask Bridge. 2026 upgrade: 0.08mm soldermask opening for 0.2mm pitch flip-chip and advanced packaging (SiP) applications. |
| 2026 New: Advanced Packaging Compatibility | SiP, Chip-on-Board (COB), Fan-out Wafer Level Packaging (FO-WLP) | 2026 key upgrade: Support integration with advanced packaging technologies (SiP/COB/FO-WLP) for AI/5G miniaturized modules, with precision alignment ±1μm. |
| 2026 New: Thermal Management | Embedded heat pipes, graphene copper clad laminate | 2026 upgrade: Integrate embedded heat pipes and graphene-enhanced copper clad laminate to improve thermal conductivity by 300% for high-power (≥500W) PCB. |
| 2026 New: Smart Manufacturing | AI visual inspection, IoT real-time process monitoring | 2026 upgrade: 100% AI visual inspection (AOI/AXI) with 99.99% defect detection rate, IoT sensors for real-time monitoring of plating/etching processes to reduce scrap rate by 15%. |