Standard Process

Standard High-End: 10 μm / 10 μm
Advanced (AI/Chiplet): 5 μm / 5 μm
Ultra-High-Density (SLP/ABF): ≤ 3 μm / 3 μm (R&D)
Microvia Diameter: 25–50 μm (laser-drilled)
Aspect Ratio: ≤ 1:0.8
Via-in-Pad (VIPPO): Filled & Capped
Stacked Vias: Up to 8 layers (Any-layer HDI)
Mainstream ABF: 20–26 layers
High-End AI/GPU: 44–78 layers
HDI: 6+n+6 (Any-layer)
Max Panel: 650 mm × 650 mm
M9/M10 CCL: Dk 3.0–3.5; Df ≤0.0005–0.002; Tg ≥170°C; CTE 14–17 ppm/°C
Ultra-Low-Loss: Dk 2.1–2.4; Df ≤0.0003
Glass (2.5D/3D): CTE ~3.0 ppm/°C
Copper Foil
Thickness: 3 μm – 4.5 μm (1/8 oz)
Type: HVLP-4/HVLP-5
Roughness (Rz): ≤1.0 μm
Plating (hole wall): 20–25 μm (±5%)
Line Width Accuracy: ±1.0 μm (mSAP/SAP)
Registration: ±1.5 μm
Impedance: ±5%

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Product Details

Shenzhen Hongda Sensor IC Substrate – Advanced Manufacturing & Technical Specifications

Cutting-Edge Sensor IC Substrate Customized for MEMS Application Scenarios

MEMS (Micro-Electro-Mechanical System) is a groundbreaking advanced manufacturing technology platform derived from semiconductor processing technology. It integrates micro-mechanisms, micro-sensors, micro-actuators, signal processing circuits and control modules into a single miniaturized device or system, and is mass-produced through high-precision micron-level semiconductor manufacturing processes. As the core carrier and key supporting component of MEMS chips, the Sensor IC Substrate must fully meet the high-performance, extreme miniaturization and ultra-high reliability requirements of MEMS sensors. Shenzhen Hongda’s 2026 generation Sensor IC Substrate has raised the industry benchmark for MEMS supporting substrates by virtue of leading-edge independent manufacturing technologies and optimized material engineering solutions tailored for MEMS scenarios.

Compared with traditional mechanical components, MEMS sensors have achieved a qualitative leap in performance and form factor: their ultra-compact structure features a maximum overall dimension of less than 1cm, even reaching the micron scale, and the core material adopts silicon-based substrates with excellent electrical performance. Silicon material has mechanical properties comparable to iron in strength and hardness, density close to aluminum, and thermal conductivity approaching that of molybdenum and tungsten. Relying on IC-compatible standardized production processes, MEMS sensors realize high batch consistency, ultra-low power consumption and cost-effective mass production, which also puts forward extremely stringent technical requirements for the matching IC substrate. Shenzhen Hongda’s Sensor IC Substrate is R&D customized for these core technical demands, and can deliver uncompromising stable performance in the most harsh and complex MEMS application scenarios.

2026 Advanced Technical Specifications (Shenzhen Hongda Sensor IC Substrate)

Based on the proven high-reliability substrate design system, and integrating Shenzhen Hongda’s self-developed 2026 latest IC Substrate PCB manufacturing technologies, the 2026 generation Sensor IC Substrate has achieved all-round optimization in material selection, precision processing and structural design, with its core technical parameters reaching the industry advanced level as follows:

表格

Core Advantages of Shengyi SI10U as the Core Material of Shenzhen Hongda Substrate

Shenzhen Hongda has selected Shengyi SI10U as the core dielectric material of the 2026 generation Sensor IC Substrate after multiple scenario tests and material performance comparisons. This halogen-free high-performance material is specially optimized for the application characteristics of MEMS sensors, and its performance advantages are highly matched with the technical demands of Shenzhen Hongda’s substrate manufacturing: its low CTE (Coefficient of Thermal Expansion) and high modulus can effectively suppress substrate warpage—a long-standing critical pain point for miniaturized MEMS devices—even under extreme and sudden temperature fluctuations in actual application. At the same time, the material has excellent heat and moisture resistance, which can ensure the stable operation of the substrate in various harsh operating environments, and has perfect process compatibility with Shenzhen Hongda’s 2026 advanced IC substrate manufacturing processes, laying a solid foundation for the consistent quality of mass-produced substrates and effectively reducing the production defect rate.

Target Application Scenarios of Shenzhen Hongda Sensor IC Substrate

The application scope of MEMS sensors has expanded rapidly from the traditional high-value industrial, military and aerospace fields (the annual market scale of MEMS substrates in this segment is about $40 million) to the mainstream high-volume consumer market, among which medical electronics has emerged as a high-value growth segment (the annual revenue of the high-value MEMS sensor industry supported by professional substrates is about $300 million). At present, the automotive electronics and consumer electronics markets have become the core demand sectors of the global MEMS sensor industry, accounting for more than 60% of the total global demand. Shenzhen Hongda’s 2026 generation Sensor IC Substrate is R&D and manufactured for these two core application fields, and has achieved targeted performance optimization especially for the automotive electronics field with the most stringent requirements.

Automotive MEMS sensors are the core sensing components of vehicle intelligent control systems, responsible for collecting critical operation data of engines, chassis and vehicle body, and their working environment is extremely harsh—facing the dual tests of high temperature, chemical corrosion, dust erosion and continuous mechanical vibration for a long time. Shenzhen Hongda’s Sensor IC Substrate, relying on the 2026 latest IC substrate manufacturing technologies, realizes ultra-low warpage, high heat/moisture resistance and micron-level precision manufacturing, which can fully ensure the long-term stable and reliable operation of automotive MEMS sensors in complex vehicle working conditions, and perfectly meet the strict reliability and long durability requirements of automotive electronic systems for core components. For the consumer electronics field, the substrate’s 0.25mm ultra-thin design and high-precision flexible interconnect structure perfectly match the development trends of miniaturization, light weight and high performance of portable smart devices such as smart phones, wearable devices and smart home terminals, and provide a reliable hardware carrier for the high integration of consumer electronic products.

Shenzhen Hongda Exclusive Technical Support & One-Stop Service System

Shenzhen Hongda has a professional R&D and technical support team with in-depth research and practical experience in the 2026 latest IC Substrates PCB manufacturing technologies and MEMS sensor substrate customization. Aiming at the personalized needs of customers in different MEMS application fields, we provide end-to-end one-stop technical assistance for all PCB-related pain points and challenges, covering the whole process from substrate design optimization, personalized material selection, process scheme customization to mass production process debugging and after-sales technical support. The Shenzhen Hongda technical team can quickly respond to customer demands, provide customized substrate solutions for different MEMS sensor models and application scenarios, and escort the mass production and product iteration of customers’ MEMS products.