About Us

About Shenzhen Hongda Circuit Technology Co., Ltd.

Full upgrade of all production equipment

PCBkr is dedicated to cooperating with customers worldwide. Keeping pace with the development of AI intelligence, we have completed a full upgrade of all production equipment, striving to build a world-class manufacturer of PCB prototypes.

Backed by over ten years of experience in PCB fabrication and SMT assembly, we implement rigorous controls over quality, lead time and costs, and fully meet all high-standard customized requirements of customers across all industries.

We are far more than your supplier. We serve as your trusted technical partner covering all PCB-related areas, providing one-stop solutions to all challenges in prototype R&D and production, so you can carry out your research and development work with complete peace of mind.

Empowering the AI & 6G Era with Next-Generation Interconnect Solutions

Founded on a legacy of precision and driven by the relentless pursuit of innovation, Shenzhen Hongda Circuit Technology Co., Ltd. (PCBKR) has evolved into a global leader in high-end Printed Circuit Board (PCB) manufacturing. As we navigate the technological landscape of 2026, we stand at the forefront of the AI Infrastructure and 6G Telecommunications revolution, providing the critical hardware foundations for tomorrow’s most ambitious projects.

Our Core Expertise: Pushing the Boundaries of Physics

In an era where data demands are exponential, standard manufacturing is no longer enough. Hongda Circuit specializes in complex, high-reliability solutions that bridge the gap between concept and reality.

  • Ultra-High Layer AI Server Solutions: Our specialized production lines now support up to 120 layers, specifically engineered for the Rubin and Blackwell architecture server environments. We ensure structural integrity and thermal stability for the world’s most powerful GPU clusters.
  • 224Gbps Signal Integrity: By utilizing advanced low-loss materials (PTFE/Thermoset) and proprietary surface treatment technologies, we achieve superior signal fidelity, meeting the rigorous standards of 800G and 1.6T networking hardware.
  • mSAP & SAP Precision: Our 2026 facility upgrade introduces Modified Semi-Additive Processes (mSAP), allowing for ultra-fine line/space widths of sub-20μm, essential for high-density mobile devices and semiconductor testing substrates.
  • Heavy Copper & Thermal Management: We lead the industry in Heavy Copper PCB fabrication (up to 12oz+), integrating advanced thermal vias and embedded busbar technology for EV power electronics and industrial energy storage.

Smart Manufacturing & Industry 4.0

At our Shenzhen-based Digital Twin Factory, quality is not just a goal—it is a data-driven certainty.

  • AI-Driven Inspection: Every board undergoes Deep Learning-based AOI (Automatic Optical Inspection) and AVI, identifying micro-anomalies that traditional systems miss.
  • Real-Time Traceability: Our clients enjoy full transparency with real-time order tracking, providing granular data on material batches, press cycles, and impedance testing reports.
  • Sustainability (Green Circuit 2026): We are committed to a zero-emission future. Our facility operates on a closed-loop water recycling system and is fully compliant with the latest global carbon footprint tracking standards.

The Hongda Advantage: Why Global Leaders Choose PCBKR

  1. Engineering Excellence: Our DFM (Design for Manufacturing) team provides proactive consulting to optimize layouts for yield and performance before a single panel is cut.
  2. Global Compliance: We exceed industry benchmarks with certifications including ISO 9001:2026, AS9100D (Aerospace), and IPC-6012 Class 3/3A.
  3. Agility at Scale: From rapid-turn prototypes to high-volume global distribution, our logistics network ensures your time-to-market is minimized.

Partner with the Future

Whether you are designing the next generation of AI-driven medical diagnostics, satellite communications, or autonomous vehicle systems, Shenzhen Hongda Circuit Technology Co., Ltd. is your strategic partner in high-performance interconnects.

Contact our engineering team today to discuss your 2026 project requirements.