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  • HDI PCB Cost Analysis cover image by Shenzhen Hongda Circuit showing an AI server board with breakdown metrics of 20-30+ layers, 28 GHz+ materials, and 50-75 µm laser microvias.
    Blog

    Why Do AI Server PCBs Cost 12× More Than Traditional Server Boards?

    作者David 06/15/202606/15/2026

    AI server PCBs cost 8–12× more than traditional server …

    阅读更多 Why Do AI Server PCBs Cost 12× More Than Traditional Server Boards?继续

  • Technical white paper cover for HDI AI server PCBs by Shenzhen Hongda, highlighting 20-layer sequential lamination stackup, ultra-low loss materials, and 224G PAM4 signal integrity metrics.
    Blog

    Ultra-Low Loss Materials in HDI AI Server PCB Manufacturing

    作者David 06/14/202606/16/2026

    Shenzhen Hongda Circuit Technology Co., Ltd. | 2026 Tec…

    阅读更多 Ultra-Low Loss Materials in HDI AI Server PCB Manufacturing继续

  • HDI PCB in AI Accelerator Cards: BGA 0.4mm Pitch Routing Challenges — Cover image featuring Shenzhen Hongda Circuit Technology Co., Ltd. branding on a deep blue background, highlighting HDI microvia technology, VIPPO structures, and advanced manufacturing solutions for AI hardware. Contact: pcb@pcbkr.com
    Blog

    HDI PCB in AI Accelerator Cards: Routing Challenges for BGA 0.4mm Pitch

    作者David 06/13/202606/16/2026

    0.4mm pitch BGA relies on 2026 upgraded HDI processes, …

    阅读更多 HDI PCB in AI Accelerator Cards: Routing Challenges for BGA 0.4mm Pitch继续

  • Cover image: AI Server 18–22 Layer HDI PCB white paper. Blue background, white text. Contact: pcb@pcbkr.com. Publisher: Shenzhen Hongda Circuit Technology, 2026.
    Blog

    Why Do High-Performance AI Servers Use 18–22 Layer HDI Multilayer PCB Designs?

    作者David 06/13/202606/16/2026

    Microsection analysis of an ultra-high-density multilay…

    阅读更多 Why Do High-Performance AI Servers Use 18–22 Layer HDI Multilayer PCB Designs?继续

  • Why HDI PCBs Are Chosen for AI Servers?
    Blog

    Why HDI PCBs Are Chosen for AI Servers?

    作者David 06/12/202606/16/2026

    AI servers demand High-Density Interconnect (HDI) PCBs …

    阅读更多 Why HDI PCBs Are Chosen for AI Servers?继续

  • HDI PCB in AI Servers
    Blog

    HDI PCB in AI Servers: The Complete Technical Guide (2026)

    作者David 06/12/202606/16/2026

    Introduction The rapid proliferation of AI infrastructu…

    阅读更多 HDI PCB in AI Servers: The Complete Technical Guide (2026)继续

  • Custom AI server PCB production in China by Shenzhen Hongda Circuit, featuring 112G/224G PAM4 and 60+ layer board fabrication.
    Blog

    Why Choose Custom AI Server PCB Production in China?

    作者David 06/11/202606/12/2026

    China dominates the custom AI server PCB manufacturing …

    阅读更多 Why Choose Custom AI Server PCB Production in China?继续

  • Manufacturing guide banner on how to choose a high-layer PCB supplier for AI accelerator projects, featuring 24-36 layer capability, IPC Class 3 standards, and ultra-low loss substrate specifications by Shenzhen Hongda Circuit Technology Co., Ltd.
    Blog

    How to Choose a High-Layer PCB Supplier for AI Accelerator PCB Projects?

    作者David 06/10/202606/12/2026

    To choose the right high-layer PCB supplier for AI acce…

    阅读更多 How to Choose a High-Layer PCB Supplier for AI Accelerator PCB Projects?继续

  • Turnkey AI Server PCB Manufacturing for 224G PAM4 by Shenzhen Hongda
    Blog

    Turnkey PCB Manufacturing for AI Server Hardware

    作者David 06/10/202606/12/2026

    Abstract: Next-generation AI clusters (UBB/OAM arc…

    阅读更多 Turnkey PCB Manufacturing for AI Server Hardware继续

  • High-density AI cluster PCB assembly and fabrication services by Shenzhen Hongda Circuit Technology
    Blog

    How Do AI Cluster PCB Assembly and Fabrication Services Optimize Performance from Design to Deployment?

    作者David 06/10/202606/12/2026

    The Architectural Ecosystem of AI Cluster Hardware AI c…

    阅读更多 How Do AI Cluster PCB Assembly and Fabrication Services Optimize Performance from Design to Deployment?继续

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Shenzhen Hongda Circuit Technology Co., Ltd

Address: Room 1608-1610, Research Development Comprehensive Building, Baoyunda Logistics Center, Baoan, Shenzhen, China

E-mail:sales@pcbkr.com

TEL:+86 0755 23720053

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© 2026 Shenzhen Hongda Circuit Technology Co., Ltd.

  • Home
  • PCB Products
    • High-Frequency PCB
    • HDI PCB
    • Multilayer PCB
    • Metal Core PCB
    • High-Speed PCB
    • Heavy Copper PCB
    • Flex PCB
    • Rigid-Flex PCB
    • IC Substrates PCB
  • PCB Assembly
    •  Advanced BGA & SMT 
    • Box Build & Cable Assy 
    • Component Sourcing
    • Turnkey & Consignment
  • Capability Overview
    • Capability
    • Advanced Equipment
    • PCB Design & Eng.
    • Standard PCB Capability
    • IC Substrate Capability
    • HDI PCB Capability
    • Rigid-Flex Capability
    • RF PCB Capability
    • High frequency PCBs Capability
  • Technology
    • 120-Layer 5G-Advanced/6G Communication Boards
    • High-Speed Semiconductor Test Boards
    • mSAP-Processed IC Package Substrates
    • Specialized Millimeter-Wave Radar PCBs
    • 224Gbps High-Frequency Microwave Circuits
    • Intelligent Industrial Control PCBs
    • FAQ
  • Blog
  • About Us
    • Certifications
  • Contact