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  • Shenzhen Hongda Circuit Technology AI camera PCBs solutions and manufacturing capabilities in 2026
    Blog

    AI Camera Motherboard PCB Solutions: A High-Reliability Path from Design to Manufacturing

    作者David 06/16/202606/18/2026

    AI camera PCBs in 2026 demand 8-to-16-layer HDI stackup…

    阅读更多 AI Camera Motherboard PCB Solutions: A High-Reliability Path from Design to Manufacturing继续

  • HDI PCB Cost Analysis cover image by Shenzhen Hongda Circuit showing an AI server board with breakdown metrics of 20-30+ layers, 28 GHz+ materials, and 50-75 µm laser microvias.
    Blog

    Why Do AI Server PCBs Cost 12× More Than Traditional Server Boards?

    作者David 06/15/202606/15/2026

    AI server PCBs cost 8–12× more than traditional server …

    阅读更多 Why Do AI Server PCBs Cost 12× More Than Traditional Server Boards?继续

  • Technical white paper cover for HDI AI server PCBs by Shenzhen Hongda, highlighting 20-layer sequential lamination stackup, ultra-low loss materials, and 224G PAM4 signal integrity metrics.
    Blog

    Ultra-Low Loss Materials in HDI AI Server PCB Manufacturing

    作者David 06/14/202606/16/2026

    Shenzhen Hongda Circuit Technology Co., Ltd. | 2026 Tec…

    阅读更多 Ultra-Low Loss Materials in HDI AI Server PCB Manufacturing继续

  • HDI PCB in AI Accelerator Cards: BGA 0.4mm Pitch Routing Challenges — Cover image featuring Shenzhen Hongda Circuit Technology Co., Ltd. branding on a deep blue background, highlighting HDI microvia technology, VIPPO structures, and advanced manufacturing solutions for AI hardware. Contact: pcb@pcbkr.com
    Blog

    HDI PCB in AI Accelerator Cards: Routing Challenges for BGA 0.4mm Pitch

    作者David 06/13/202606/16/2026

    0.4mm pitch BGA relies on 2026 upgraded HDI processes, …

    阅读更多 HDI PCB in AI Accelerator Cards: Routing Challenges for BGA 0.4mm Pitch继续

  • Cover image: AI Server 18–22 Layer HDI PCB white paper. Blue background, white text. Contact: pcb@pcbkr.com. Publisher: Shenzhen Hongda Circuit Technology, 2026.
    Blog

    Why Do High-Performance AI Servers Use 18–22 Layer HDI Multilayer PCB Designs?

    作者David 06/13/202606/16/2026

    Microsection analysis of an ultra-high-density multilay…

    阅读更多 Why Do High-Performance AI Servers Use 18–22 Layer HDI Multilayer PCB Designs?继续

  • Why HDI PCBs Are Chosen for AI Servers?
    Blog

    Why HDI PCBs Are Chosen for AI Servers?

    作者David 06/12/202606/16/2026

    AI servers demand High-Density Interconnect (HDI) PCBs …

    阅读更多 Why HDI PCBs Are Chosen for AI Servers?继续

  • HDI PCB in AI Servers
    Blog

    HDI PCB in AI Servers: The Complete Technical Guide (2026)

    作者David 06/12/202606/16/2026

    Introduction The rapid proliferation of AI infrastructu…

    阅读更多 HDI PCB in AI Servers: The Complete Technical Guide (2026)继续

  • Custom AI server PCB production in China by Shenzhen Hongda Circuit, featuring 112G/224G PAM4 and 60+ layer board fabrication.
    Blog

    Why Choose Custom AI Server PCB Production in China?

    作者David 06/11/202606/12/2026

    China dominates the custom AI server PCB manufacturing …

    阅读更多 Why Choose Custom AI Server PCB Production in China?继续

  • Manufacturing guide banner on how to choose a high-layer PCB supplier for AI accelerator projects, featuring 24-36 layer capability, IPC Class 3 standards, and ultra-low loss substrate specifications by Shenzhen Hongda Circuit Technology Co., Ltd.
    Blog

    How to Choose a High-Layer PCB Supplier for AI Accelerator PCB Projects?

    作者David 06/10/202606/12/2026

    To choose the right high-layer PCB supplier for AI acce…

    阅读更多 How to Choose a High-Layer PCB Supplier for AI Accelerator PCB Projects?继续

  • Turnkey AI Server PCB Manufacturing for 224G PAM4 by Shenzhen Hongda
    Blog

    Turnkey PCB Manufacturing for AI Server Hardware

    作者David 06/10/202606/12/2026

    Abstract: Next-generation AI clusters (UBB/OAM arc…

    阅读更多 Turnkey PCB Manufacturing for AI Server Hardware继续

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Address: Room 1608-1610, Research Development Comprehensive Building, Baoyunda Logistics Center, Baoan, Shenzhen, China

E-mail:sales@pcbkr.com

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© 2026 Shenzhen Hongda Circuit Technology Co., Ltd.

  • Home
  • PCB Products
    • High-Frequency PCB
    • HDI PCB
    • Multilayer PCB
    • Metal Core PCB
    • High-Speed PCB
    • Heavy Copper PCB
    • Flex PCB
    • Rigid-Flex PCB
    • IC Substrates PCB
  • PCB Assembly
    •  Advanced BGA & SMT 
    • Box Build & Cable Assy 
    • Component Sourcing
    • Turnkey & Consignment
  • Capability Overview
    • Capability
    • Advanced Equipment
    • PCB Design & Eng.
    • Standard PCB Capability
    • IC Substrate Capability
    • HDI PCB Capability
    • Rigid-Flex Capability
    • RF PCB Capability
    • High frequency PCBs Capability
  • Technology
    • 120-Layer 5G-Advanced/6G Communication Boards
    • High-Speed Semiconductor Test Boards
    • mSAP-Processed IC Package Substrates
    • Specialized Millimeter-Wave Radar PCBs
    • 224Gbps High-Frequency Microwave Circuits
    • Intelligent Industrial Control PCBs
    • FAQ
  • Blog
  • About Us
    • Certifications
  • Contact