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  • Banner image for AI PCB manufacturing article titled "Why AI PCBs Need Much More Than HDI Technology" by Shenzhen Hongda Circuit Technology (PCBKR), highlighting 224G PAM4 signaling and CoWoS routing.
    Blog

    Why AI PCBs Need Much More Than HDI Technology

    作者David 06/03/202606/12/2026

    Introduction: The Quantitative Realities of AI Hardware…

    阅读更多 Why AI PCBs Need Much More Than HDI Technology继续

  • alt="Technical comparison diagram between AI Server PCB and RF PCB highlighting layer count, substrate materials, and manufacturing challenges."
    Blog

    AI PCB vs RF PCB: Which One Is Harder To Manufacture?

    作者David 06/03/202606/12/2026

    AI PCB vs RF PCB Direct Summary: AI PCBs present a high…

    阅读更多 AI PCB vs RF PCB: Which One Is Harder To Manufacture?继续

  • Technical whitepaper cover for Shenzhen Hongda Circuit Technology titled "Is AI PCB Just Another High-Speed PCB?", featuring a 3D high-layer count vertical PCB stackup structure, 68 layers mega stack icon, 224Gbps PAM4 ready, and 1200W+ transient thermal management metrics.
    Blog

    Is AI PCB Just Another High-Speed PCB?

    作者David 06/02/202606/12/2026

    A Paradigmatic Shift from Signal Integrity to Compute D…

    阅读更多 Is AI PCB Just Another High-Speed PCB?继续

  • Why AI PCBs cannot use standard FR-4 materials: insertion loss comparison between FR-4 and Megtron 6 at 14GHz by Shenzhen Hongda Circuit Technology.
    Blog

    Why AI PCBs Cannot Use Standard FR-4 Materials

    作者David 06/02/202606/12/2026

    Standard FR-4 materials fail in AI PCBs because their h…

    阅读更多 Why AI PCBs Cannot Use Standard FR-4 Materials继续

  • AI Server PCB vs Traditional PCB technical specifications comparison chart banner
    Blog

    What Makes AI Server PCBs Different From Traditional Enterprise PCBs?

    作者David 06/01/202606/12/2026

    The global shift toward high-performance computing and …

    阅读更多 What Makes AI Server PCBs Different From Traditional Enterprise PCBs?继续

  • How to Choose an AI Backplane PCB Manufacturer — A complete buyer's and engineering guide covering material selection, signal integrity, 112G/224G PAM4 requirements, and IPC Class 3 standards for high-speed data center infrastructure.
    Blog

    How to Choose an AI Backplane PCB Manufacturer: The Ultimate Buyer’s & Engineering Guide

    作者David 06/01/202606/12/2026

    Finding a highly capable AI Backplane PCB Manufact…

    阅读更多 How to Choose an AI Backplane PCB Manufacturer: The Ultimate Buyer’s & Engineering Guide继续

  • Why AI Servers Demand Higher PCB Layer Counts: A comparison of stackup layers for 224G PAM4 AI servers and backplanes.
    Blog

    Why AI Servers Demand Higher PCB Layer Counts

    作者David 05/31/202606/12/2026

    When evaluating the infrastructure powering next-genera…

    阅读更多 Why AI Servers Demand Higher PCB Layer Counts继续

  • Why High-Speed Backplanes Fail EMC Compliance
    Blog

    Why High-Speed Backplanes Fail EMC Compliance

    作者David 05/30/202606/12/2026

    Table of Contents Why High-Speed Backplanes Frequently …

    阅读更多 Why High-Speed Backplanes Fail EMC Compliance继续

  • Comparison of Orthogonal Backplane PCB and traditional architecture showing signal paths for 112G and 224G PAM4 data centers.
    Blog

    What is the difference between an orthogonal backplane and a traditional backplane architecture in data centers?

    作者David 05/30/202606/12/2026

    In the hardware development of next-generation data cen…

    阅读更多 What is the difference between an orthogonal backplane and a traditional backplane architecture in data centers?继续

  • Cross-section diagram of an AI Backplane showing CTE mismatch and delamination risks under a 95mm ASIC package during thermal cycling.
    Blog

    How CTE Mismatch Causes Delamination in AI Backplanes

    作者David 05/29/202606/12/2026

    AI Backplanes operate under extreme thermal cyclin…

    阅读更多 How CTE Mismatch Causes Delamination in AI Backplanes继续

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Shenzhen Hongda Circuit Technology Co., Ltd

Address: Room 1608-1610, Research Development Comprehensive Building, Baoyunda Logistics Center, Baoan, Shenzhen, China

E-mail:sales@pcbkr.com

TEL:+86 0755 23720053

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Technology

120-Layer 5G-Advanced/6G Communication Boards

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Intelligent Industrial Control PCBs

© 2026 Shenzhen Hongda Circuit Technology Co., Ltd.

  • Home
  • PCB Products
    • High-Frequency PCB
    • HDI PCB
    • Multilayer PCB
    • Metal Core PCB
    • High-Speed PCB
    • Heavy Copper PCB
    • Flex PCB
    • Rigid-Flex PCB
    • IC Substrates PCB
  • PCB Assembly
    •  Advanced BGA & SMT 
    • Box Build & Cable Assy 
    • Component Sourcing
    • Turnkey & Consignment
  • Capability Overview
    • Capability
    • Advanced Equipment
    • PCB Design & Eng.
    • Standard PCB Capability
    • IC Substrate Capability
    • HDI PCB Capability
    • Rigid-Flex Capability
    • RF PCB Capability
    • High frequency PCBs Capability
  • Technology
    • 120-Layer 5G-Advanced/6G Communication Boards
    • High-Speed Semiconductor Test Boards
    • mSAP-Processed IC Package Substrates
    • Specialized Millimeter-Wave Radar PCBs
    • 224Gbps High-Frequency Microwave Circuits
    • Intelligent Industrial Control PCBs
    • FAQ
  • Blog
  • About Us
    • Certifications
  • Contact